ملخصات الابحاث

المجالات البحثية

الابحاث العلمية

1 - Synergistic effect of MWCNT addition on the thermal and elastic properties of Sn–5Sb–0.3Cu alloy (2023).

2 - Exceptional strength-ductility synergy of Ni and Co-Mg-La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite (2023).

3 - Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0Ag–0.5Cu solder alloy (2022).

4 - Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field (2021).

5 - Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field (2020).

6 - Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field (2019).

7 - Advancement solidification microstructure and mechanical properties of Sn–2.0Ag–0.5Cu alloy by applying a rotary magnetic field (2019).

8 - Study The Properties of Sintered Al-Composites Matrix Reinforced With Nano-Al Oxide And/Or Carbon Nano Tubes (2018).

9 - Study The Properties of Sintered Al-Composites Matrix Reinforced With Nano-Al Oxide And/Or Carbon Nano Tubes (2018).

10 - Impact of permanent magnet stirring on dendrite growth and elastic properties of SneBi alloys revealed by pulse echo overlap method (2018).

11 - Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu leadfree solder by adding trace amount of elements Ni and Sb (2018).

12 - Enhancement of Fluorescence and Photostability Based on Interaction of Fluorescent Dyes with Silver Nanoparticles for Luminescent Solar Concentrators (2017).

13 - Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles (2017).

14 - Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles (2017).

15 - Nano-Lead free solder alloys for electronic packaging and integration (2016).

16 - Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 (2014).

17 - Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn (2014).

18 - Influence of Zn addition on the microstructure,melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders (2014).

19 - Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy (2013).

20 - Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions (2013).

21 - Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni (2013).

22 - Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications (2013).

23 - Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions (2012).

24 - Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions (2012).

25 - Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In (2011).

26 - Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In (2011).

ملخصات الابحاث

Nano-Lead free solder alloys for electronic packaging and integration تحميل

Development of high strength Sn–0.7Cu solders with the addition of small amount of Ag and In تحميل

Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions تحميل

Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions تحميل

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni تحميل

Design of lead-free candidate alloys for low-temperature soldering applications based on the hypoeutectic Sn–6.5Zn alloy تحميل

Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn تحميل

Structural and elastic properties of eutectic Sn–Cu lead-free solder alloy containing small amount of Ag and In تحميل

Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders تحميل

Enhancing mechanical response of hypoeutectic Sn–6.5Zn solder alloy using Ni and Sb additions تحميل

Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles تحميل

Enhancement of Fluorescence and Photostability Based on Interaction of Fluorescent Dyes with Silver Nanoparticles for Luminescent Solar Concentrators تحميل

Elastic properties and thermal behavior of Sn–Zn based lead-free solder alloys تحميل

Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders تحميل

Creep properties of Sn–Sb based lead-free solder alloys تحميل

Influences of Ag and Au Additions on Structure and Tensile Strength of Sn-5Sb Lead Free Solder Alloy تحميل

Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu leadfree solder by adding trace amount of elements Ni and Sb تحميل

Study The Properties of Sintered Al-Composites Matrix Reinforced With Nano-Al Oxide And/Or Carbon Nano Tubes تحميل

In the current work, applying a rotating magnetic field (RMF) is an innovative approach to improve تحميل

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